Join the STACK Project in a Joint Application to Hop-on Facility
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The STACK project, funded by the EIC Pathfinder programme, invites organisations from Widening countries to join us in preparing a joint proposal for the upcoming Hop-on Facility call, under the Horizon Europe Widening programme. We are seeking expressions of interest from institutions committed to scientific excellence, frontier research, and the development of novel technologies. This collaboration offers an opportunity to contribute to the advancement of cutting-edge research in on computational design and digital fabrication solutions for freeform surface stackability, while reinforcing excellence in research across Europe's widening regions.
The STACK project pioneers a new mathematical framework and computational design solutions for freeform surface stackability, supported by 3D elastica theory. This foundational work enables advanced digital fabrication methods—such as hot blade cutting—and showcases its potential within the Architecture, Engineering, and Construction (AEC) sector.
Our work spans five interconnected themes at the interface of geometry, architecture, and fabrication:
• Mathematical Theory
• Computational Design
• Digital Fabrication
• Logistics
• Interdisciplinary Integration
We welcome applications from legal entities based in Widening countries as defined under Horizon Europe, including:
• Universities and research institutes
• SMEs or startups with a strong R&D or innovation profile
Ideal partners will offer proven R&D expertise in STACK’s research themes, actively foster research capacity-building, international collaboration, and technology transfer, and share our commitment to scientific excellence and open innovation.
Please submit a maximum 2-page concept proposal including:
• A brief overview of your organization or group, and core areas of expertise
• Names and short bios of key researchers involved (including their ORCID IDs)
• Your proposed role in the project and a short explanation of your contributions highlighting how they align with the objectives of the STACK project and expand its scope.
Send your concept proposal to Lene Lad Johansen by July 10, 2025. Shortlisted candidates will be contacted for follow-up discussions and proposal co-development for the September 4, 2025 application deadline.
Joining this consortium offers you the opportunity to:
• Collaborate with leading European researchers and innovation actors
• Strengthen your visibility and engagement in Horizon Europe projects
• Contribute to shaping the future of computational design and digital fabrication solutions for the AEC sector and beyond.
Up to €600,000 in funding is available to the new beneficiary for this action.
Contact us:
Scientific inquiries: Dr. Konstantinos Gavriil, Principal Investigator, STACK
Administrative, practical questions and submission of proposals: Lene Lad Johansen, Senior Business Developer, SINTEF Digital and STACK
Learn more about the STACK project
Hop-on facility: WIDERA Call Details: Hop-on facility
About EIC Pathfinder EIC Pathfinder - European Commission
The STACK project, funded by the EIC Pathfinder programme, invites organisations from Widening countries to join us in preparing a joint proposal for the upcoming Hop-on Facility call, under the Horizon Europe Widening programme. We are seeking expressions of interest from institutions committed to scientific excellence, frontier research, and the development of novel technologies. This collaboration offers an opportunity to contribute to the advancement of cutting-edge research in on computational design and digital fabrication solutions for freeform surface stackability, while reinforcing excellence in research across Europe's widening regions.
The STACK project pioneers a new mathematical framework and computational design solutions for freeform surface stackability, supported by 3D elastica theory. This foundational work enables advanced digital fabrication methods—such as hot blade cutting—and showcases its potential within the Architecture, Engineering, and Construction (AEC) sector.
Our work spans five interconnected themes at the interface of geometry, architecture, and fabrication:
• Mathematical Theory
• Computational Design
• Digital Fabrication
• Logistics
• Interdisciplinary Integration
We welcome applications from legal entities based in Widening countries as defined under Horizon Europe, including:
• Universities and research institutes
• SMEs or startups with a strong R&D or innovation profile
Ideal partners will offer proven R&D expertise in STACK’s research themes, actively foster research capacity-building, international collaboration, and technology transfer, and share our commitment to scientific excellence and open innovation.
Please submit a maximum 2-page concept proposal including:
• A brief overview of your organization or group, and core areas of expertise
• Names and short bios of key researchers involved (including their ORCID IDs)
• Your proposed role in the project and a short explanation of your contributions highlighting how they align with the objectives of the STACK project and expand its scope.
Send your concept proposal to Lene Lad Johansen by July 10, 2025. Shortlisted candidates will be contacted for follow-up discussions and proposal co-development for the September 4, 2025 application deadline.
Joining this consortium offers you the opportunity to:
• Collaborate with leading European researchers and innovation actors
• Strengthen your visibility and engagement in Horizon Europe projects
• Contribute to shaping the future of computational design and digital fabrication solutions for the AEC sector and beyond.
Up to €600,000 in funding is available to the new beneficiary for this action.
Contact us:
Scientific inquiries: Dr. Konstantinos Gavriil, Principal Investigator, STACK
Administrative, practical questions and submission of proposals: Lene Lad Johansen, Senior Business Developer, SINTEF Digital and STACK
Learn more about the STACK project
Hop-on facility: WIDERA Call Details: Hop-on facility
About EIC Pathfinder EIC Pathfinder - European Commission
